
IEC 61690-1 Ed. 1.0 en:2000
Electronic design interchange format (EDIF) – Part 1: Version 3 0 0. (This publication is available in electronic HTML format only)
standard by International Electrotechnical Commission, 01/31/2000
Electronic design interchange format (EDIF) – Part 1: Version 3 0 0. (This publication is available in electronic HTML format only)
standard by International Electrotechnical Commission, 01/31/2000
Recording – Helical-scan digital video cassette recording system using 6,35 mm magnetic tape for consumer use (525-60, 625-50, 1125-60 and 1250-50 systems) – Part 10: DTV format
standard by International Electrotechnical Commission, 02/22/2001
Corrugated pressboard and presspaper for electrical purposes – Part 2: Methods of test
standard by International Electrotechnical Commission, 11/06/1998
Multichannel digital audio tape recorder (DATR), reel-to-reel system, for professional use – Part 2: Format B
standard by International Electrotechnical Commission, 06/10/1997
Electrical insulation systems – Procedures for thermal evaluation – Part 32: Multifactor evaluation with increased factors during diagnostic testing
standard by International Electrotechnical Commission, 10/14/2019
Communication networks and systems in substations – Part 10: Conformance testing
standard by International Electrotechnical Commission, 05/30/2005
Amendment 1 – Corrugated pressboard and presspaper for electrical purposes – Part 2: Methods of test
Amendment by International Electrotechnical Commission, 06/06/2007
Industrial communication networks – Profiles – Part 5-2: Installation of fieldbuses – Installation profiles for CPF 2
standard by International Electrotechnical Commission, 07/22/2010
Industrial communication networks – Profiles – Part 2: Additional fieldbus profiles for real-time networks based on ISO/IEC 8802-3
standard by International Electrotechnical Commission, 04/10/2019
Industrial communication networks – Profiles – Part 3-13: Functional safety fieldbuses – Additional specifications for CPF 13
standard by International Electrotechnical Commission, 07/15/2016