
IEC 62680-1-2 Ed. 2.0 en:2017
Universal serial bus interfaces for data and power – Part 1-2: Common components – USB Power Delivery specification
standard by International Electrotechnical Commission, 06/22/2017
Universal serial bus interfaces for data and power – Part 1-2: Common components – USB Power Delivery specification
standard by International Electrotechnical Commission, 06/22/2017
Residual current operated circuit-breakers for household and similar use – Part 1: Outline of blocks and modules for residual current device standards<br />
standard by International Electrotechnical Commission, 01/25/2017
Test method for erosion of wave soldering equipment using molten lead-free solder alloy – Part 2: Erosion test method for metal materials with surface processing
standard by International Electrotechnical Commission, 07/13/2016
Measurement method of a half-wavelength voltage and a chirp parameter for Mach-Zehnder optical modulator in high-frequency radio on fibre (RoF) systems
standard by International Electrotechnical Commission, 07/27/2017
Semiconductor devices – Semiconductor interface for human body communication – Part 3: Functional type and its operational conditions
standard by International Electrotechnical Commission, 04/26/2016
Universal serial bus interfaces for data and power – Part 1-6: Common components – USB Audio 3.0 device class definition basic functions
standard by International Electrotechnical Commission, 09/19/2019
Consumer terminal function for access to IPTV and open internet multimedia services – Part 7: Authentication, content protection and service protection
standard by International Electrotechnical Commission, 07/26/2017
Test methods for the characterization of organic transistor-based ring oscillators
standard by International Electrotechnical Commission, 08/05/2013
Text-to-speech for television – General requirements
standard by International Electrotechnical Commission, 01/29/2013
Measurement procedures for materials used in photovoltaic modules – Part 1-5: Encapsulants – Measurement of change in linear dimensions of sheet encapsulation material resulting from applied thermal conditions
standard by International Electrotechnical Commission, 06/28/2016