
IPC CH-65A
Guidelines for Cleaning of Printed Boards and Assemblies
Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1999
Guidelines for Cleaning of Printed Boards and Assemblies
Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1999
Surface Insulation Resistance Handbook
standard by Association Connecting Electronics Industries, 09/01/2007
Spherical Bend Test Method for Characterization of Board Level Interconnects
standard by Association Connecting Electronics Industries, 09/01/2011
Automotive Applications Addendum to IPC-6012D, Qualficiation and Performance Specification for Rigid Printed Boards
Amendment by Association Connecting Electronics Industries, 12/01/2018
Monotonic Bend Characterization of Board-Level Interconnects
standard by Association Connecting Electronics Industries, 06/01/2004
Optoelectronics Assembly and Packaging Technology
standard by Association Connecting Electronics Industries, 05/01/2003
Implementation of Ball Grid Array and Other High Density Technology
standard by Association Connecting Electronics Industries, 08/01/1996
Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
standard by Association Connecting Electronics Industries, 10/01/2011
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2018
Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes
standard by Association Connecting Electronics Industries, 10/01/2016