• 2019-12-28
• Admin
• no comments

IPC 2315

Design Guide for High Density Interconnects & Microvias
Handbook / Manual / Guide by Association Connecting Electronics Industries, 06/01/2000

• 2019-12-28
• Admin
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IPC 9501

PWB Assembly Process Simulation for Evaluation of Electronic Components
standard by Association Connecting Electronics Industries, 07/10/1995

• 2019-12-28
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• no comments

IPC D-859

Design Standard for Thick Film Multilayer Hybrid Circuits
standard by Association Connecting Electronics Industries, 12/01/1989

• 2019-12-28
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• no comments

IPC 2516A

Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description
standard by Association Connecting Electronics Industries, 11/01/2000

• 2019-12-28
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• no comments

IPC A-40

Solder Mask Artwork
standard by Association Connecting Electronics Industries,

• 2019-12-28
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• no comments

IPC TR-465-1

Round Robin Test on Steam Ager Temperature Control Stability
standard by Association Connecting Electronics Industries, 01/01/1993

• 2019-12-28
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IPC FC-234A

Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid, or Rigid-Flex Printed Boards
standard by Association Connecting Electronics Industries, 11/01/2014

• 2019-12-28
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• no comments

IPC A-25A-G

Multipurpose 1 Sided Test Pattern – Gerber Format
standard by Association Connecting Electronics Industries,

• 2019-12-28
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IPC TMRC99R

TMRC 1999 Market for Flexible Circuits – TMRC99F
Report / Survey by Association Connecting Electronics Industries, 01/01/1999

• 2019-12-28
• Admin
• no comments

IPC D-354

Library Format Description for Printed Boards in Digital Form
standard by Association Connecting Electronics Industries, 02/01/1987