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IPC 9702-WAM1

Monotonic Bend Characterization of Board-Level Interconnects with Amendment 1
standard by Association Connecting Electronics Industries, 05/01/2015

IPC A-610C

Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 01/01/2000

IPC 6202

Performance guide Manual for single- and double-sided flexible printed wiring boards
standard by Association Connecting Electronics Industries, 10/01/1999

IPC 2612-1

Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
standard by Association Connecting Electronics Industries, 03/01/2010

IPC 2291

Design Guideline for Printed Electronics
standard by Association Connecting Electronics Industries, 06/01/2013

IPC FC-234

Pressure Sensitive Adhesives Assembly Guidelines for Single-Sided and Double-Sided Printed Circuits
standard by Association Connecting Electronics Industries, 12/10/1997

IPC 9261A

In-Process DPMO and Estimated Yield for PCAs
standard by Association Connecting Electronics Industries, 10/01/2006

IPC 8701

Final Acceptance Criteria Standard for PV Modules-Final Module Assembly
standard by Association Connecting Electronics Industries, 06/01/2014