
IPC 4104
Specifications for High Density Interconnect (HDI) and Microvia Materials
standard by Association Connecting Electronics Industries, 05/01/1999
Specifications for High Density Interconnect (HDI) and Microvia Materials
standard by Association Connecting Electronics Industries, 05/01/1999
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 07/01/2008
Guidelines for Cleaning of Printed Boards and Assemblies
Handbook / Manual / Guide by Association Connecting Electronics Industries, 07/01/2011
Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A Requirements and Acceptance for Cable and Wire Harness Assemblies
Amendment by Association Connecting Electronics Industries, 06/01/2012
Bare Substrate Electrical Test Data Format
standard by Association Connecting Electronics Industries, 10/01/2002
Selection and Application of Board Level Underfill Materials
standard by Association Connecting Electronics Industries, 02/01/2014
Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 04/01/2010
Cleaning and Cleanliness Test Program Phase 1 Test Results
standard by Association Connecting Electronics Industries, 10/01/1989
Accelerated Aging for Solderability Evaluations
standard by Association Connecting Electronics Industries, 12/01/1987