IPC J-STD-005

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Lists general requirements for characterization and test of metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. (This is a quality control document and is not intended to relate directly to a material’s performance in the manufacturing process). Supersedes QQ-S-571.

Product Details

Published:

01/01/1995

ANSI:

ANSI Approved

Number of Pages:

38

File Size:

1 file , 320 KB

Part of:

IPC A-20/21-GKIT

Product Code(s):

J-005(D)1

Note:

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