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JEDEC JEP159A

PROCEDURE FOR THE EVQLUQTION OF LOW-k/METAL INTER/INTRA-LEVEL DIELECTRIC INTEGRITY
standard by JEDEC Solid State Technology Association, 07/01/2015

JEDEC JESD79-3-2

Addendum No. 2 to JESD79-3 – 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, and DDR3L-1600
Amendment by JEDEC Solid State Technology Association, 10/01/2011

JEDEC J-STD-035

JOINT IPC/JEDEC STANDARD FOR ACOUSTIC MICROSCOPY FOR NONHERMETRIC ENCAPSULATED ELECTRONIC COMPONENTS
standard by JEDEC Solid State Technology Association, 05/01/1999

JEDEC JESD22-B113

BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
standard by JEDEC Solid State Technology Association, 03/01/2006

JEDEC JESD22-A111B

EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
standard by JEDEC Solid State Technology Association, 03/01/2018

JEDEC JESD8-2

ADDENDUM No. 2 to JESD8 – STANDARD FOR OPERATING VOLTAGES AND INTERFACE LEVELS FOR LOW VOLTAGE EMITTER-COUPLED LOGIC (ECL) INTEGRATED CIRCUITS
standard by JEDEC Solid State Technology Association, 03/01/1993